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CHPPE Newsletter
February, 2015

 CHPPE Welcomes its New Faculty Member

     
Dr. Fang Luo officially joined CHPPE on Nov 1st, 2014, as a research assistant professor. Dr. Luo got his PhD degree from Huazhong University of Science and Technology, Wuhan, China, in 2010 (Jointly with Virginia Tech). He was a postdoc researcher and then a scientist at Virginia Tech from 2010 to 2014. His research interests include high density EMI filtering and wide bandgap power module packaging. Dr. Luo will also perform the duty as the director of the CHPPE industry consortium.






CHPPE announces its new research facility

 CHPPE announces its integrated  power electronics module packaging  and integration lab. The new research  facility covers the processes of device  die-handling, inter-  connection, soldering and  encapsulation. It also provides basic  testing capability for  packaging reliability.
 








 
New equipment for the power electronics
module packaging and integration lab.

 



CHPPE Research Update

 
Dr. Wu Lu, professor of CHPPE, and his team have developed new processes using high density plasma, the Lu group for etching microstructures (micro pillars, back vias, and hollow structures) in silicon with controlled profiles and high aspect ratios. Such structures can be used for efficient heat dissipation and cooling in advanced packaging of power switch transistors.



The CHPPE packaging team has finished its clean room dry run, and has fabricated two mock-up modules. Miao Wang (CHPPE PhD student was leading the research on the high temperature SiC module), Chengcheng Yao (CHPPE PhD student), Wenwei Li and Jinziyang Qian (CHPPE Master's student) were leading the research on the vertical power module.






Student Awards

The Power & Energy Society (PES) is a of society of IEEE. 
A few years ago it established a "PES Scholarship Plus" Initiative.

Future Power and Energy Leaders
The PES Scholarship Plus Initiative™ supports the most promising future engineers in the fields of power and energy. Recipients are high-achieving undergraduate students in electrical engineering programs who have committed to exploring the power and energy engineering fields through both coursework and career experiences. PES regional volunteer leaders select recipients following the application submission period ending in June of each year. 

The 2014-2015 Awardees
These awardees are undergraduate students are majoring in electrical engineering, are high achievers with strong GPAs with distinctive extracurricular commitments and are committed to exploring the power and energy field. These scholarships are made possible due to the generous donations of individuals and corporations to the IEEE Power & Energy Society Scholarship Fund of the IEEE Foundation.

Awardees at OSU, 2014-2015
The names of the five awardees at OSU-ECE for 2014-2015,
with the year of their expected graduation:

Arline, Jamison, 2015
McCray, Benjamin, 2015
Scherer, David, 2015
Scherer, Mary, 2017
Wolfe, Matthew, 2016
 
 Each year a small number of these awardees can get a higher-level
scholarship among the best of all students. There were seven recipients of the John W. Estey Outstanding PES Scholars for 2014-2015, and each one is the top student of IEEE Regions 1-7, respectively. Mary Scherer was found to be the best awardee in IEEE Region 2, and thus she was one of the seven John W. Estey Outstanding PES Scholars for 2014-2015. More information can be found at:

http://www.ee-scholarship.org/about-scholarship/john-w-estey-award/2014-2015/

 









Department of Electrical and Computer Engineering
Center for High Performance Power Electronics
205 Dreese Labs
2015 Neil Ave.
Columbus, OH 43210
614.292.7596 
614.292.7596 (fax)
chppe.osu@gmail.com
https://chppe.osu.edu/

UPCOMING EVENTS

http://www.apec-conf.org/
March 15 - 19, 2015

Mission Statement:
“Once completed, CHPPE will be a world-class power electronics laboratory, located at the Ohio State University, specifically designed to exploit the high temperature, high frequency operation and efficiency advantages of silicon carbide (SiC)-based  power electronics."
 

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